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  1. 24 de jun. de 2024 · Memory cells – the chip components that store electronic data – include short-term volatile (such as DRAM) and long-term non-volatile (such as flash) storage types. DRAM is the mainstay for “working” (active) memory, while flash memory is used to store large amounts of data in a compact form.

  2. 20 de jun. de 2024 · DRAM frequency is directly related to how quickly a system can access its memory. For instance, at a higher frequency, the memory can transfer more data per second, enhancing overall system responsiveness and performance.

  3. 27 de jun. de 2024 · Embrace the future of memory technology as Dr. Choe unravels the exciting prospects of 3D X-DRAM. Whether it's through TSV stacked DRAMs or hybrid DRAM wafer bonding technology, we'll explore the most promising approaches to extend DRAM scaling to new horizons.

  4. 11 de jun. de 2024 · DRAM. Dynamic RAM is a form of random access memory. DRAM uses a capacitor to store each bit of data, and the level of charge on each capacitor determines whether that bit is a logical 1 or 0. However these capacitors do not hold their charge indefinitely, and therefore the data needs to be refreshed periodically.

  5. 27 de jun. de 2024 · The memory technology landscape is continuously evolving. DRAM and NAND Flash memory demands have been steadily increasing and emerging memory markets such as STT-MRAM, ReRAM, PCRAM, FeRAM, and 3D XPoint memory are expected to reach $36 billion by 2030.

  6. 27 de jun. de 2024 · DRAM cell scaling down to the 10 nm design rule (D/R) has been ongoing. Major DRAM players have been developing the next generations, so-called D1b, D1c, and beyond. This means the DRAM cell D/R might be further scaled down to the single-digit nanometer era.

  7. 24 de jun. de 2024 · The paper detailed that SK Hynix's five-layer stacked 3D DRAM has achieved a memory yield of 56.1%. The experimental 3D DRAM demonstrated characteristics similar to existing 2D DRAM.